EC2645TTS-33.000M TR

EC26 Series REGULATORY COMPLIANCE 2011/65 + 2015/863 191 SVHC ITEM DESCRIPTION Quartz Crystal Clock Oscillators XO (SPXO) LVCMOS (CMOS) 3.3Vdc 4 Pad 5.0mm x 7.0mm Ceramic Surface Mount (SMD) ELECTRICAL SPECIFICATIONS Nominal Frequency 1.544MHz to 200MHz Frequency Tolerance/Stability Inclusive of all conditions: Calibration Tolerance at 25°C, Frequency Stability over the Operating Temperature Range, Supply Voltage Change, Output Load Change, First Year Aging at 25°C, Shock, and Vibration ±100ppm Maximum ±50ppm Maximum ±20ppm Maximum ±25ppm Maximum ±5ppm/year Maximum Aging at 25°C Operating Temperature Range -10°C to +70°C -40°C to +85°C Supply Voltage 3.3Vdc ±10% Input Current 10mA Maximum over Nominal Frequency of 1.544MHz to 32MHz 18mA Maximum over Nominal Frequency of 32MHz to 50MHz 20mA Maximum over Nominal Frequency of 50.000001MHz to 70MHz 40mA Maximum over Nominal Frequency of 70.000001MHz to 125MHz 60mA Maximum over Nominal Frequency of 125.000001MHz to 200MHz IOH = -8mA 90% of Vdd Minimum Output Voltage Logic High (VOH) Output Voltage Logic Low (VOL) Rise/Fall Time IOL = +8mA 10% of Vdd Maximum Measured at 20% to 80% of waveform 5nSec Maximum (w/15pF Load), 7nSec Maximum (w/30pF Load) over Nominal Frequency of 1.544MHz to 35MHz 3nSec Maximum over Nominal Frequency of 35.000001MHz to 165MHz 2nSec Maximum over Nominal Frequency of 165.000001MHz to 200MHz Duty Cycle Measured at 50% of waveform 50 ±10(%) 50 ±5(%) Load Drive Capability Output Logic Type 30pF Maximum over Nominal Frequency of 1.544MHz to 35MHz 15pF Maximum over Nominal Frequency of 35.0000001MHz to 200MHz CMOS Pin 1 Connection Tri-State (High Impedance) Output Control Input Voltage Logic High (Vih) Output Control Input Voltage Logic Low (Vil) Standby Current 70% of Vdd Minimum or No Connect to Enable Output. 30% of Vdd Maximum to Disable Output (High Impedance) Start Up Time Disabled Output, High Impedance 10µA Maximum 12kHz to 20MHz offset frequency 1pSec Maximum 10mSec Maximum Storage Temperature Range -55°C to +125°C RMS Phase Jitter Revised W: 6/1/2015 Page 2 of 12 www.ecliptek.com EC26 Series PART NUMBERING GUIDE Revised W: 6/1/2015 Page 3 of 12 www.ecliptek.com EC26 Series MECHANICAL DIMENSIONS SUGGESTED SOLDER PAD LAYOUT PIN CONNECTION 1 Tri-State 2 Case/Ground 3 Output 4 Supply Voltage All Tolerances are ±0.1 All Dimensions in Millimeters Revised W: 6/1/2015 Page 4 of 12 www.ecliptek.com EC26 Series OUTPUT WAVEFORM & TIMING DIAGRAM Revised W: 6/1/2015 Page 5 of 12 www.ecliptek.com EC26 Series TEST CIRCUIT FOR CMOS OUTPUT Note 1: An external 0.1µF low frequency tantalum bypass capacitor in parallel with a 0.01µF high frequency ceramic bypass Capacitor close to the package ground pin is required. Note 2: A low input capacitance (10Mohms), and High bandwidth (>300MHz) Passive probe is recommended. Note 3: Capacitance value (CL) includes sum of all probe and fixture capacitance. See applicable specification sheet for ‘Load Drive Capability’. Revised W: 6/1/2015 Page 6 of 12 www.ecliptek.com EC26 Series TAPE & REEL DIMENSIONS Quantity per Reel: 1,000 Units All Dimensions in Millimeters Compliant to EIA-481 Revised W: 6/1/2015 Page 7 of 12 www.ecliptek.com EC26 Series RECOMMENDED SOLDER REFLOW METHOD HIGH TEMPERATURE INFRARED/CONVECTION TS MAX to TL (Ramp-up Rate) 3°C/Second Maximum Preheat - Temperature Minimum (TS MIN) - Temperature Typical (TS TYP) - Temperature Maximum(TS MAX) - Time (tS) 150°C 175°C 200°C 60 - 180 Seconds Ramp-up Rate (TL to TP) Time Maintained Above: - Temperature (TL) - Time (tL) 3°C/Second Maximum Peak Temperature (TP) 260°C Maximum for 10 Seconds Maximum Target Peak Temperature(TP Target) 250°C +0/-5°C Time within 5°C of actual peak (tp) 20 - 40 Seconds Ramp-down Rate 6°C/Second Maximum Time 25°C to Peak Temperature (t) 8 Minutes Maximum Moisture Sensitivity Level Level 1 Additional Notes Temperatures shown are applied to body of device. 217°C 60 - 150 Seconds High Temperature Manual Soldering 260°C Maximum for 5 Seconds Maximum, 2 times Maximum. (Temperatures shown are applied to body of device.) Revised W: 6/1/2015 Page 8 of 12 www.ecliptek.com EC26 Series RECOMMENDED SOLDER REFLOW METHOD LOW TEMPERATURE INFRARED/CONVECTION TS MAX to TL (Ramp-up Rate) 5°C/Second Maximum Preheat - Temperature Minimum (Ts MIN) - Temperature Typical (Ts TYP) - Temperature Maximum(Ts MAX) - Time (ts) N/A 150°C N/A 60 - 120 Seconds Ramp-up Rate (TL to TP) Time Maintained Above: - Temperature (TL) - Time (tL) 5°C/Second Maximum Peak Temperature (TP) 240°C Maximum Target Peak Temperature (TP Target) 240°C Maximum 2 Times / 230˚C Maximum 1 Time Time within 5°C of actual peak (tp) 10 Seconds Maximum 2 Times / 80 Seconds Maximum 1 Time Ramp-down Rate 5°C/Second Maximum Time 25°C to Peak Temperature (t) N/A Moisture Sensitivity Level Level 1 Additional Notes Temperatures shown are applied to body of device. 150°C 200 Seconds Maximum Low Temperature Manual Soldering 185°C Maximum for 10 Seconds Maximum, 2 times Maximum. (Temperatures shown are applied to body of device.) Revised W: 6/1/2015 Page 9 of 12 www.ecliptek.com